On November 16, 2012, the 2012 Shanghai Electroplating and Surface Treatment Academic Exchange Conference, which was hosted by the Shanghai Electroplating Special Committee of the Shanghai Electronics Society (referred to as the "Special Committee") and the Shanghai Electroplating Association, was successfully held. Attending the meeting were the director of the Special Committee, Professor Yu Zuzhan of the Department of Chemistry, Fudan University, Professor Long Huqiang, Secretary-General of the Shanghai Institute of Electronics, Xue Zi, Deputy Secretary-General of the Shanghai Integrated Circuit Industry Association, Rotating Director of the Special Committee, Shanghai Jiaotong University Materials Professor Li Ming, etc. Sun Jiangyan, deputy director of the special committee and chief engineer of the company, attended the meeting and presided over the opening ceremony of the conference. The conference shared 17 academic reports such as "Application of Electroplating Technology in IC Manufacturing", "New Development of Electronic Plating Technology in Electronic Packaging", and "Application of Surface Material Analysis Technology in Electroplating Technology". Guo Jie, the engineer of the company's technology center, made a report on "Bump Electroplating Process and Reliability Research" and shared nearly 200 people with the latest research results, product advantages and application solutions of the company's electroplating solutions and additives in the field of advanced packaging.
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