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  • Traditional encapsulation of semiconductor
  • Traditional encapsulation of semiconductor
  • Aerospace aircraft electronic chemical materials
location: HOME > PRODUCTS > Traditional encapsulation of semiconductor

Traditional encapsulation of semiconductor

SYM-SSP Series High Speed Plating Line

This equipment integrates following components such as continuous loading and unloading system, high speed and consistent plating technology and full-process computer monitoring system to make itself to be a very robust system which has high automatic control , steady plating quality and wide production application . At the same time, there are also many rational unique fine designs and good manufacturing techniques to make such an environment friendly and energy saving equipment. We can provide different equipment configurations to meet customers’ requirements for different production capability, plating process and process automation level.

Equipment framework:Strip to Strip Plating Line and Straight Strip Plating Line
Process Speed:6-8m/min
Loading Framework:Semi-Automatic (Strip to Strip)) or Full-Automatic (Magazine to Magazine)
Application Range:All kinds of leadframe with frame size >3mm

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