All new design plating equipment with independent intellectual property, highly focus on semiconductor packaging industry. Without any penalty on plating quality and production capability, still enable to accomplish energy saving, lower emission and cutting cost, comparing with conventional rack plating, lower total energy cost 80%, shrink equipment size 50%, reduce Tin consumption 20-40%.
Production Capability：≥1500Strip/hr(Able to configure base on products and process requirements
Equipment Framework ：Straight Type Single Travelling Crane Plating Line
Application Range：All kinds of leadframe, especially for TO series packaging
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