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  • Traditional encapsulation of semiconductor
  • Traditional encapsulation of semiconductor
  • Aerospace aircraft electronic chemical materials
location: HOME > PRODUCTS > Traditional encapsulation of semiconductor

Traditional encapsulation of semiconductor

SYM-SSD Series High Pressure Water Jet

SYM-SSD Series High Pressure Water Jet Specially designed for moulding flash removal, hundreds of equipments already provided to customers.

There are many different models which able to cover almost all kinds of packaging products.

Clamping method is divided into strip transmission, belt transmission, flexible transfer roller.

Water Jet pressure range from 200,300,400,600, to maximum 800kg/cm2 configuration.

Production capability can up to 1000-4000 Strip/hr.

Process flow can be electrolysis + high pressure water jet or high pressure water jet only.

Manual, semi-automatic and automatic loading and unloading system.


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