Our SYS series chemicals are ultra-pure products which fulfilled the requirement of wafer foundries. This series particularly highlight the low amount of trace metals and particles which is one of the decisive factors for device quality in wafer foundries. They can be used in wafer level plating and surface treatment processes. For instance: Damascene Process, 3D Through Silicon Via (TSV) Process, Wafer Bumping Process, MEMS Plating Process, Solar Cell Wafer Plating Process, Silicon Wafer Surface Treatment Chemicals and other wet process treatment chemicals. The main products of SYS series include: Electroplating Chemicals Ultra-Pure Copper Interconnect electroplating solution and its additives ( Sulfate and MSA based);Tin electroplating chemicals etc.Photoresist (PR) strippers and cleaners (positive PR stripper series, negative PR Stripper Series,and dry/wet etching cleaning chemicals.Silicon surface treatment chemicals (backgrinding chemicals, cleaning chemicals, dicing and slicing chemicals ).
The main products:
■ Copper Plating Solution SYS 2300 Series
■ Copper Plating Solution SYS 2300 Series
■ Copper Plating Additives for Through Silicon Via (TSV) of Advanced Wafer Level Packaging SYS UPT 3300 Series
■ Copper Plating Addtives for Bumping of Advanced Wafer Level Packaging SYS UPB 3200 Series
■ Negative Photoresist Stripper SYS 9510
■ Positive Photoresist Stripper SYS 9610
■ Post-Etch Residue Remover SYS 9070
Privacy protection ｜ Legal statement｜ SiteMap
COPYRIGHT© 2023 Shanghai Sinyang All Rights Reserved.
