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Recently, the 26th China International Optoelectronic Exposition (CIOE) and the SEMI-e Shenzhen International Semiconductor Exhibition were held concurrently in Shenzhen. Shanghai Sinyang Semiconductor Materials Co., Ltd. participated in the exhibitions with a series of products for advanced packaging and optoelectronic applications, exploring cutting-edge industrial trends and deepening industry chain cooperation alongside over 5,000 enterprises worldwide.


The co-hosted dual exhibitions formed a synergistic "Optoelectronics + Semiconductor" ecosystem. CIOE focused on optoelectronic fields such as optical communication, lasers and infrared technology, while SEMI-e covered the entire semiconductor industry chain including design, manufacturing, packaging, materials and equipment. Shanghai Sinyang highlighted its key offerings including photoresist alternatives, packaging electroplating solutions, wafer cleaning technologies and polishing slurries, which attracted a large number of industry experts and clients to stop and communicate.


During the exhibitions, the Sunya team held in-depth discussions with new partners including the Hong Kong Microelectronics Research Institute, Guoke Optical Core and BYD Semiconductor on topics such as process compatibility, product quality and delivery assurance, and reached preliminary cooperation intentions on several projects. Meanwhile, the company also met again with clients previously contacted at the China International Industry Fair, further consolidating cooperative relationships and achieving cross-exhibition resource integration.


This participation not only helped Sinyang accurately grasp market dynamics and customer needs, but also promoted in-depth exchanges with peers and upstream & downstream enterprises. Shanghai Sinyang stated that going forward, it will continue to be customer demand-oriented and technology innovation-driven, actively participate in the integrated development of "Optoelectronics + Semiconductor", and contribute professional strength to the advancement of the semiconductor materials industry.

The company’s product "Electroplating Solution and Additives for Chip Copper Interconnection" won the Integrated Circuit Innovation Achievement Award at the Industry Expo.
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