The dicing blade is the core tool for precision cutting of wafers into individual chip units. For chips of different materials and processes, it is necessary to accurately match dicing blades of different specifications to ensure cutting quality and chip yield.
• Prevents silicon debris contamination during dicing
• No corrosion to chip pads
• Environmentally friendly product
Product Characteristics
• Features outstanding performance and stability, widely used in electronic packaging and semiconductor industries, compliant with international quality standards, effectively improving production efficiency and product reliability.
• Exhibits excellent wettability during soldering, rapidly and uniformly covering the pad surface to ensure strong and consistent solder joints, thereby enhancing overall interconnect quality.
• Adopts a special formulation that ensures no corrosion or damage to chip pads during use, protecting device integrity and long-term service life.
Diamond Dicing Blade
Product Applications
• Grooving and cutting processing for various hard and brittle non-metallic materials
Product Characteristics
• Long service life with excellent wear resistance. It maintains outstanding performance even under long-term, high-intensity working conditions, significantly reducing replacement frequency and operating costs.
• Precise cutting control. Adopting precision molding processing technology and strict quality inspection, it ensures that each cut achieves the expected effect with minimal errors.
• Superior corrosion resistance. Using a special anti-corrosion bonding agent, it greatly improves the blade’s corrosion resistance, reduces serpentine cutting and blade breakage, and ensures stable cutting.
• Stable cutting quality. Compatible with various semiconductor chips including silicon wafers, gallium arsenide, and silicon carbide, it delivers flat, smooth cuts with consistent precision.
• A wide range of blade models to cover diverse application scenarios, providing highly customized dicing solutions and meeting customers’ specific requirements.
• Customized diamond abrasives that significantly enhance cutting capability and processing quality, satisfying high-difficulty and high-precision machining demands.
• Professional after-sales support, including timely technical assistance, rapid response to anomalies, and application guidance, ensuring customers complete peace of mind.
