Plating & Additives
Copper interconnects are the "neural networks" of modern chips. Like microscopic wires, they are responsible for transmitting electrical signals between billions of transistors and serve as the lifeline of information flow. Their excellent electrical conductivity and low-power characteristics are the key to enabling chips to achieve high speed, high performance and small size.
- • Damascene Copper Interconnect Electroplating
- • Products cover all copper interconnect electroplating processes above 14nm
- • Supporting Equipment: LAM and AMAT
- • Boasts excellent bottom-up filling capability, enabling efficient, void-free filling of deep holes and high-aspect-ratio structures.
- • Achieves defect-free, high-quality filling across various critical dimensions (CD), adapting to diverse process requirements.
- • The product adheres to green and environmental protection principles, reducing the use and emission of hazardous substances and contributing to sustainable development.
