- • Pure tin electroplating processes for semiconductor package leads, such as high-speed plating, rack plating, barrel plating, vibratory plating, etc.
- • Suitable for matte/bright plating process requirements of methanesulfonic acid system/sulfuric acid system
- • The coating features an extremely dense and uniform crystalline structure with high overall appearance consistency, and delivers excellent solderability, effectively ensuring reliable bonding and stability during soldering.
- • High internal purity of the coating significantly strengthens resistance to tin whisker formation, while effectively preventing discoloration and other reliability issues during reflow soldering or high-temperature and high-humidity storage.
- • The product fully complies with green environmental requirements, is free of hazardous substances, eco-friendly, and consistent with the concept of sustainable development.
- • Process for removing encapsulation flash from semiconductor lead frames, such as SOT/SOP/TO/QFN packages.
- • Process for removing tape residue from QFN/DFN packaged devices.
- • Uses safe and eco-friendly raw materials, balancing high performance with low environmental impact, in compliance with modern green production standards.
- • Causes no corrosion or damage to various lead frame substrates and encapsulant materials, compatible with both conventional and new eco-friendly molding compounds, featuring excellent universality.
