•Overview of the 50,000-ton IC Key Process Materials Project, Headquarters & R&D Center in Songjiang, Shanghai

•Phase I of 2nd Production Base in Hefei, Anhui successfully launched.

•Company’s 5th core technology — Electronic Etching Technology officially released.

•Project Initiation & Planning of the Production Base in Shanghai Chemical Industry Park

•Initiated the R&D project of polishing slurry for wafer manufacturing, establishing the fourth core technology direction

•Initiated the R&D project of photoresist for wafer manufacturing, officially laying out the third core technology — photoresist

•The company developed its second-generation core technologies for electronic electroplating and electronic cleaning, with its technological strength continuously enhanced

•In June, the company was successfully listed on the ChiNext Board of the Shenzhen Stock Exchange (Stock Code: 300236)

•The company’s new plant in Songjiang was completed and put into operation, marking a new stage in production capacity and R&D capabilities.

•The first-generation core technologies for electronic electroplating and electronic cleaning were developed, laying the foundation for a relatively complete technical system and product portfolio.

•The company acquired land and built a factory in Jiangqiao Town, Jiading District, Shanghai, owning its first proprietary production base.

•The company’s first product—defalshing solution SYD712—was successfully launched onto the market, marking its official entry into the semiconductor packaging field.

•In July, Shanghai Sinyang Chemical Co., Ltd. was established, kicking off its entrepreneurial journey.